Nirmal Sigamani

Nirmal Shankar Sigamani is a process development manager of the Sabre 3D product line at Lam Research Corporation. He earned his PhD degree in mechanical engineering, specializing in materials research, from The Pennsylvania State University before joining Lam Research in 2015. Leading a team focused on advancing semiconductor wafer fabrication processes, Sigamani plays a key role in enhancing wafer-level packaging (WLP) applications. His work primarily impacts copper pillar, redistribution layers (RDLs), underbump metallization (UBM), lead-free C4 bumping, Cu/SnAg and Ni/Au microbumps, high-density fan-out (HDFO) applications (megapillar, RDL, 2-in-1 via, micropillars). He has been spearheading WLP applications with a strong focus on high bandwidth memory (HBM), a critical component in AI computing. With expertise in addressing challenges in metal electrochemical deposition (Cu, Ni, SnAg and Au), Sigamani also identifies opportunities for future industrial advancements including reducing cost of ownership, minimizing defects and achieving reliable and void-free microbumps and solder joints.